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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 tsz22111 ? 14? 001 www.rohm.com datashee t cmos ldo regulators for portable equipments 1ch 200ma cmos ldo regulators buxxsa4 series general description buxxsa4 series are high-performance cmos ldo regulators with output current ability of up to 200-ma. these devices have excellent noise and load response characteristics despite of its low circuit current consumption of 40a. they are most appropriate for various applications such as power supplies for logic ic, rf, and camera modules. features ? high output voltage accuracy: 0.6% ( 15mv on vout<2.5v) ? high ripple rejection: 70 db (typ, 1 khz,) ? compatible with small ceramic capacitor (cin=cout=0.47 f) ? low current consumption: 40 a ? output voltage on/off control ? built-in over current protection circuit (ocp) ? built-in thermal shutdown circuit (tsd) ? adopting ultra-small wlcsp ucsp50l1 applications ? portable devices ? camera modules ? other electronic devices using microcontrollers or logic circuits key specifications ? input power supply voltage range: 1.7v to 5.5v ? output current range: 0 to 200ma ? operating temperature range: -40 to +85 ? output voltage lineup: 1.8v,2.5v,2.55v 2.8v,3.0v,3.3v ? output voltage accuracy: 0.6% ? circuit current: 40a(typ.) ? standby current: 0 a (typ.) package w(typ.) x d(typ.) x h(max.) ucsp50l1(buxxsa4wgwl) 0.8mm x 0.8mm x 0.5mm typical application circuit figure 1. typical application circuit vin cin cout vout vin vout stby gnd on off buxxsd2mg-m vin cin cout vout vin vout stby gnd on off buxxsd2mg-m vin cin cout vout vin vout stby gnd on off buxxsd2mg-m buxxsa4
datasheet datasheet 2/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series figure 2. block diagram cin(min)=0.47 f (ceramic) cout(min)=0.47 f (ceramic) pin configuration pin description pin no. symbol function a1 gnd gnd pin a2 stby output control pin (high:on, low:off) b1 vout output pin b2 vin input pin block diagram 1 3 5 2 cin vin gnd stby vstby vout vout cout vref stby tsd vin n.c. 4 ocp top view (mark side) a b 12 bottom view b a 12 1pin mark
datasheet datasheet 3/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series absolute maximum ratings parameter symbol rating unit power supply voltage v max -0.3 to +6.5 v power dissipation pd 410 (*1) mw maximum junction temperature tjmax +125 operating temperature range topr -40 to +85 storage temperature range tstg -55 to +125 (*1) derate by 4.1mw/ when operating above ta=25 .(when mounted on a board 63mm 55mm 1.6mm glass-epoxy board, 9 layer) recommended operating ratings parameter symbol limit unit input power supply voltage range vin 1.7 to 5.5 v recommended operating conditions parameter symbol rating unit conditions min. typ. max. input capacitor cin 0.47 (*2) 1.0 f a ceramic capacitor is recommended. output capacitor cout 0.47 (*2) 1.0 f a ceramic capacitor is recommended. (*2) set the value of the capacitor so t hat it does not fall below the minimum value. take into consideration the temperature characteristics, dc device characteristics, and degradation with time.
datasheet datasheet 4/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series electrical characteristics (unless otherwise noted, ta=-25 , v in =v out +1.0v (*6) , v stby =1.5v, cin=1 f, cout=1 f. ) parameter symbol limit unit conditions min. typ. max. output voltage 1 vout1 vout 0.994 vout vout 1.006 v iout = 10 a, vout R2.5v vout -15mv vout +15mv iout = 10 a, vout 2.5v output voltage 2 vout2 vout 0.98 vout vout 1.02 v iout=0 to 200ma, vout R2.5v vin=vout+0.5 to 5.5v ta=-40 to +85 (*3,4,5) vout -50mv vout +50mv iout=0 to 200ma, vout 2.5v vin=3.0 to 5.5v ta=-40 to +85 (*3,4,5) circuit current 1 ignd1 - 40 65 a iout=0ma circuit current 2 ignd2 - 40 80 a ta=-40 to +85 (*4) , iout=0ma circuit current (stby) iccst - - 1.0 a stby=0v ripple rejection ratio1 rr1 - 70 - db vrr=-20dbv,frr=1khz,iout=10ma ripple rejection ratio2 rr2 - 55 - db vrr=-20dbv,frr=10khz,iout=10ma ripple rejection ratio3 rr3 - 45 - db vrr=-20dbv,frr=100khz,iout=10ma dropout voltage vdrop - 80 150 mv vin=0.98vout, iout=100ma ta=-40 to +85 , vout R2.5v - 150 360 mv vin=0.98vout, iout=100ma ta=-40 to +85 , vout 2.5v load transient resp. vlot - 65 - mv io=1 to 150ma,t rise =t fall =1 s, vin=vout+1.0v (*4) line transient resp. vlit - 5 - mv vin=vout+0.5 to vout+1.0v, t rise =t fall =10 s output noise voltage vnois - 30 - vrms bandwidth 10 to 100khz startup time tst - 100 300 sec output voltage settled within tolerancies line regulation vdli - 2 8 mv iout=10ma vin=vout+0.5 to 5.5v (*5) load regulation1 vdlo1 - 2 8 mv iout=1 to 100ma load regulation2 vdlo2 - 4 16 mv iout=1 to 200ma maximum output current iomax 200 - - ma vin=vout+1.0v (*6) limit current ilmax 250 400 - ma vo=vout0.98 short current ishort - 100 200 ma vo=0v stby pin current istby - - 4.0 a ta=-40 to +85 stby control voltage on vstbh 1.1 - vin v off vstbl -0.2 - 0.5 v (*3) operating conditions are limited by pd. (*4) typical values apply for ta=25 . (*5) vin=3.0v to 5.0v for vout 2.5v. (*6) vin=3.5v for vout 2.5v.
datasheet datasheet 5/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 .) figure 3. output voltage vs. input voltage figure 4. line regulation figure 5. gnd current vs. input voltage figure 6. load regulation 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 00.5 11.522.5 33.544.5 55.5 input voltage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50ma iout=200ma 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50ma iout=200ma 0 20 40 60 80 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) gnd current (ua) vin=stby iout=0ua temp=-40c temp=25c temp=85c 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 0 50 100 150 200 output current (ma) output voltage (v) vin=2.8v stby=1.5v temp=-40c temp= 25c temp=85c
datasheet datasheet 6/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 .) figure 7. gnd current vs. output current figure 8. ocp threshold figure 9. output voltage vs. temperature figure 10. gnd current vs. temperature 0 20 40 60 80 100 120 0 50 100 150 200 output current (ma) gnd current (ua ) vin=2.8v stby=1.5v temp=- 40c temp=25c temp=85 0.0 0.5 1.0 1.5 2.0 2.5 0 100 200 300 400 500 output current (a) output voltage (v) vi n= 5. 5v vin=2.3v vin=2.8v temp=25c stby=1.5v 1.74 1.76 1.78 1.80 1.82 1.84 1.86 -40 -15 10 35 60 85 temperature (c) output voltage (v) vin=2.8v stby=1.5v io=0.1ma 0 10 20 30 40 50 60 -40 - 15 10 35 60 85 temperature (c) gnd current (ua ) vin=2.8v stby=1.5v io=0.1ma
datasheet datasheet 7/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -15 10 35 60 85 temperature (c) gnd current (at stby) (na) vin=5.5v stby=0 v figure 11. stby threshold figure 12. gnd current (at stby) vs. temperature figure 13. stby pin current vs. stby pin voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.25 0.5 0.75 1 1.25 1.5 stby voltage (v) output voltage (v) temp=-40c temp=25c temp=85c vin=2.8v io=0.1ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 stby voltage (v) stby pin current (ua) temp=-40c temp=25c temp=85c
datasheet datasheet 8/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 14. ripple rejection vs. input voltage figure 15. ripple rejection vs. freqency figure 16. output noise vs. output current 0 10 20 30 40 50 60 70 80 90 100 100 1000 10000 100000 frequency (hz) ripple rejection (db) ta = 25 iout = 10ma 0 10 20 30 40 50 60 70 80 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) ripple rejection (db) ta = 25 iout = 10ma vin_ac = -20dbv 0 10 20 30 40 50 60 70 0 50 100 150 200 output current (ma) output noise (uvrms) ta = 25 vin = 2.8v 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output noise density (uv / hz) ta = 25 iout = 10ma figure 17. output noise density vs. frequency
datasheet datasheet 9/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 20. discharge time ( rout = none ) figure 21. discharge time ( rout = 9 ohm ) figure 19. startup time ( rout = 9 ohm ) figure 18. startup time ( rout = none ) 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v ) stby=0v1.5v vout cout=0.47uf cout=1uf cout=2.2uf 1v/div 1v/div vin=2.8v 20us/div stby=0v1.5v cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v ) 1v/div 1v/div vin=2.8v 20us/div stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) output volatage(v ) 1v/div 1v/div vin=2.8v 400ms/div 0.0 2.0 1.0 3.0 stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v ) 1v/div 1v/div vin=2.8v 20us/div
datasheet datasheet 10/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu18sa4wgwl (unless otherwise specified, ta=25 , cin = cout =1 f.) figure 22. load response ( iout = 1ma 150ma) figure 23. load response ( iout = 150ma 1ma) figure 24. line response ( vin= 2.3v 2.9v) figure 25. line response ( vin= 2.9v 2.3v) output volatage(v) 0 200 100 output current(ma) 1.75 1.85 1.80 1.70 vout 50mv/div 100ma/div 2.0us/div iout=1ma150ma vin=2.8v stby=2.8v cout=1uf 50mv/div 2.0us/div 1.80 1.90 1.85 1.75 iout=150ma1ma 100ma/div vin=2.8v stby=2.8v cout=1uf 0 200 100 output current(ma) output volatage(v) vout vin=2.3v2.9v 1.79 1.81 1.80 output volatage(v) 10mv/div 200mv/div 10us/div 2.3 2.7 2.5 2.9 stby=2.3v2.9v io=10ma cout=1uf input voltage(v) vin=2.9v2.3v vout 200mv/div 10us/div 2.3 2.7 2.5 2.9 1.79 1.81 1.80 output volatage(v) stby=2.9v2.3v io=10ma cout=1uf input voltage(v)
datasheet datasheet 11/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 .) figure 26. output voltage vs. input voltage figure 27. line regulation figure 28. gnd current vs. input voltage figure 29. load regulation 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 00.5 11.52 2.53 3.544.5 55.5 input voltage (v) output voltage (v) temp=25c io=0ua io=50ma io=200ma vin=stby 2.70 2.73 2.75 2.78 2.80 2.83 2.85 2.88 2.90 00.511.522.533.544.555.5 input voltage (v) output voltage (v) temp=25c io=0ua io=50ma io=200ma vin=stby 0 20 40 60 80 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) gnd current (ua) io=0ua vin=stby temp=-40c temp=25c temp=85c 2.70 2.74 2.78 2.82 2.86 2.90 0 50 100 150 200 output current (ma) o utput voltage (v) vin= 3.8v stby=1.5v temp=- 40c temp= 25c temp=85c
datasheet datasheet 12/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 .) figure 30. gnd current vs. output current figure 31. ocp threshold figure 32. output voltage vs. temperature figure 33. gnd current vs. temperature 0 20 40 60 80 100 120 0 50 100 150 200 output current (ma) gnd current (ua ) vin=3.8v stby=1.5v temp=- 40c temp=25c temp= 85c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 500 output current (a) output voltage (v) vin=3.3v vin=3.8v vin=5.5v 2.75 2.76 2.77 2.78 2.79 2.80 2.81 2.82 2.83 2.84 2.85 -40 -15 10 35 60 85 temperature (c) output voltage (v) vin=3.8v stby=1.5v io=0.1ma 0 10 20 30 40 50 60 -40 -15 10 35 60 85 temperature (c) gnd current (ua ) vin=3.8v stby=1.5v io=0.1ma
datasheet datasheet 13/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -15 10 35 60 85 temperature (c) gnd current (at stby) (na) vin=5.5v stby=0 v figure 34. stby threshold figure 35. g nd current (at stby) vs. temperature figure 36. stby pin current vs. stby voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.25 0.5 0.75 1 1.25 1.5 stby voltage (v) output voltage (v) temp= -40c temp= 25c temp= 85c vin= 3.8v io=0.1ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 00.51 1.522.533.54 4.555.5 stby voltage (v) stby pin current (ua) temp=-40c temp=25c temp=85c 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 output current (ma) dropout voltage (m v) vin = 0.98 x vout stby=1.5v temp= - 40c temp= 25c temp=85c figure 37. dropuout voltage vs. output current
datasheet datasheet 14/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f. ) figure 38. ripple rejection vs. input voltage figure 39. ripple rejection vs. frequency figure 40. output noise vs. output current 0 10 20 30 40 50 60 70 80 2.8 3.3 3.8 4.3 4.8 5.3 input voltage (v) ripple rejection (db) ta = 25 iout = 10ma vin_ac = - 20dbv 0 10 20 30 40 50 60 70 80 100 1000 10000 100000 frequency (hz) ripple rejection (db) ta = 25 iout = 10ma 0 10 20 30 40 50 60 70 0 50 100 150 200 output current (ma) output noise (uvrms) ta = 25 vin = 3.8v 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output noise density (uv / hz) ta = 25 iout = 10ma figure 41. output noise density vs. frequency
datasheet datasheet 15/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 44. discharge time ( rout = none ) figure 45. discharge time ( rout = 14 ohm ) figure 42. startup time ( rout = none ) figure 43. startup time ( rout = 14 ohm ) stby=0v1.5v cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=3.8v 20us/div 3.0 vout vout stby=0v1.5v cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 1v/div 1v/div vin=3.8v 20us/div 0.0 2.0 1.0 output volatage(v) 3.0 vout stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=3.8v 400ms/div 3.0 stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div 20us/div vin=3.8v 3.0
datasheet datasheet 16/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu28sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 46. load response ( iout = 1ma 150ma) figure 47. load response ( iout = 150ma 1ma) figure 48. line response ( vin= 3.3v 3.9v) figure 49. line response ( vin= 3.9v 3.3v) vout output volatage(v) 50mv/div 100ma/div 2.0us/div 0 200 100 output current(ma) 2.75 2.85 2.80 2.70 iout=1ma150ma vin=3.8v stby=3.8v cout=1uf output current(ma) vout 50mv/div 2.0us/div output volatage(v) 2.80 2.80 2.85 2.75 iout=150ma1ma 100ma/div vin=3.8v stby=3.8v cout=1uf 0 200 100 vin=3.3v3.9v vout 2.79 2.81 2.80 output volatage(v) 10mv/div 200mv/div 10us/div 3.3 3.7 3.5 3.9 stby=3.3v3.9v iout=10ma cout=1uf input voltage(v) vin=3.9v3.3v vout 10mv/div 200mv/div 10us/div stby=3.9v3.3v iout=10ma cout=1uf 2.79 2.81 2.80 output volatage(v) 3.3 3.7 3.5 3.9 input voltage(v)
datasheet datasheet 17/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 .) figure 50. output voltage vs. input voltage figure 51. line regulation figure 52. gnd current vs. input voltage figure 53. load regulation 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 00.511.522.533.544.555.5 input volatage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50ma iout=200ma 2.90 2.92 2.94 2.96 2.98 3.00 3.02 3.04 3.06 3.08 3.10 00.5 11.5 22.5 33.5 44.5 55.5 input voltage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50ma iout=200ma 0 20 40 60 80 100 00.51 1.522.533.54 4.555.5 input voltage (v) gnd current (ua) temp= - 40c temp=25c temp=85c vin=stby iout=0ua 2.90 2.92 2.94 2.96 2.98 3.00 3.02 3.04 3.06 3.08 3.10 0 50 100 150 200 output current (ma) output voltage (v) vin= 4.0v stby=1.5v temp=-40c temp=25c temp=85c
datasheet datasheet 18/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 .) figure 54. gnd current vs. output current figure 55. ocp threshold figure 56. output voltage vs. temperature figure 57. gnd current vs. temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 500 output current (ma) output voltage (v) vin=5.5v vin=3.5v vin=4.0v temp=25c stby=1.5v 0 20 40 60 80 100 120 0 50 100 150 200 output current (ma) gnd current (ua) temp= - 40c vin= 4.0v stby=1.5v temp=85c temp=25c 2.90 2.92 2.94 2.96 2.98 3.00 3.02 3.04 3.06 3.08 3.10 -40 -15 10 35 60 85 temperature (c) output voltage (v) vcc= 4.0v stby=1.5v iout=0.1ma 0 10 20 30 40 50 60 -40 -15 10 35 60 85 temperature (c) gnd current (ua) vin=4.0v stby=1.5v iout=0.1ma
datasheet datasheet 19/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -15 10 35 60 85 temperature (c) gnd current (at stby) (na) vin=5.5v stby=0 v figure 59. gnd current(at stby) vs. temperature figure 60. stby pin voltage vs. stby pin current figure 61. dropout voltage vs. output current 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 00.250.50.7511.251.5 stby voltage (v) output voltage (v) tem p =85c temp=-40c temp=25c vin=4.0v iout=0.1ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 stby voltage (v) stby pin current (ua) temp= -40c temp= 25c temp= 85c 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 output current (ma) dropout voltage (mv) vcc = 0.98 x vout stby=1.5v temp=-40c temp=25c temp=85c figure 58. stby threshold
datasheet datasheet 20/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 62. ripple rejection vs. input voltage figure 63. ripple rejection vs. frequency figure 64. output noise vs. output current 0 10 20 30 40 50 60 70 80 3 3.5 4 4.5 5 5.5 input voltage (v) ripple rejection (db) ta = 25 iout = 10ma vin_ac = -20dbv 0 10 20 30 40 50 60 70 80 100 1000 10000 100000 frequency (hz) ripple rejection (db) ta = 25 iout = 10ma 0 10 20 30 40 50 60 70 0 50 100 150 200 output current (ma) output noise (uvrms) ta = 25 vin = 4.0v 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output noise density (uv / hz) ta = 25 iout = 10ma figure 65. output noise density vs. frequency
datasheet datasheet 21/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 68. discharge time ( rout = none ) figure 69. discharge time ( rout = 15 ohm ) figure 66. startup time ( rout = none ) figure 67. startup time ( rout = 15 ohm ) stby=0v1.5v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=4.0v 20us/div 3.0 stby=0v1.5v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=4.0v 20us/div 3.0 stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) output volatage(v) 1v/div 1v/div vin=4.0v 400ms/div 0.0 2.0 1.0 3.0 stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 20us/div 3.0 vin=4.0v 1v/div
datasheet datasheet 22/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu30sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) figure 70. load response ( iout = 1ma 150ma) figure 71. load response ( iout = 150ma 1ma) figure 72. line response ( vin= 3.5 v 4.1 v) figure 73. line response ( vin= 4.1 v 3.5 v) output current(ma) vout output volatage(v) 50mv/div 100ma/div 2.0us/div 0 200 100 2.95 3.05 3.00 2.9 iout=1ma150ma vin = 4.0 v stby = 1.5 v cout = 1 uf vout 50mv/div 2.0us/div output volatage(v) iout=150ma1ma 100ma/div vin = 4.0 v stby = 1.5 v cout = 1 uf 0 200 100 output current(ma) 2.95 3.05 3.00 3.10 vin=3.5v4.1v vout 2.99 3.01 3.00 output volatage(v) 10mv/div 200mv/div 10us/div 3.5 3.9 3.7 4.1 stby=3.5v4.1v iout=10ma cout=1uf input voltage(v) vin=4.1v3.5v vout 10mv/div 200mv/div 10us/div 3.5 3.9 3.7 4.1 2.99 3.01 3.00 output volatage(v) stby=4.1v3.5v iout=10ma cout=1uf input voltage(v)
datasheet datasheet 23/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 .) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50ma iout=200ma 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 00.511.522.533.544.555.5 input voltage (v) output voltage (v) temp=25c vin=stby iout=0ua iout=50m a iout=200m a 0 20 40 60 80 100 00.511.522.533.544.555.5 input voltage (v) gnd current (ua) temp=-40c temp=25c temp=85c vin=stby iout=0ua 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0 50 100 150 200 output current (ma) output voltage (v) temp=25c temp=85c temp=-40c vin=4.3v stby=1.5v figure 74. output voltage vs. input voltage figure 75. line regulation figure 76. gnd current vs. input voltage figure 77. load regulation
datasheet datasheet 24/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 .) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 500 output current (ma) output voltage (v) vin=3.8v vin=4.3v vin=5.5v 0 20 40 60 80 100 120 0 50 100 150 200 output current (ma) gnd current (a) temp=85c temp=25c temp=-40c figure 78. gnd current vs. output current figure 79. ocp threshold 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 -40 -15 10 35 60 85 temperature (c) output voltage (v) vin=4.3v stby=1.5v iout=0.1m a 0 10 20 30 40 50 60 -40 -15 10 35 60 85 temperature (c) gnd current (a) vin=4.3v stby=1.5v iout=0.1 a figure 80. output voltage vs. temperature figure 81. gnd current vs. temperature
datasheet datasheet 25/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -15 10 35 60 85 temperature (c) gnd current (at stby) (na) vin=5.5v stby=0v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.25 0.5 0.75 1 1.25 1.5 stby voltage (v) output voltage (v) temp=-40c temp=85c temp=25c vin=4.3v iout=0.1m a figure 82. stby threshold figure 83. g nd current (at stby) vs. temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 stby voltage (v) stby pin current (a) tem p=-40c temp=25c temp=85c 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 output current (ma) dropout vout [v] tem p=-40c temp=85c tem p=25c vin=0.98 vout stby=1.5v figure 84. stby pin current vs. stby voltage figure 85. dropout voltage vs. output current
datasheet datasheet 26/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) 0 10 20 30 40 50 60 70 80 3.3 3.8 4.3 4.8 5.3 input voltage (v) ripple rejection (db) ta = 25 iout = 10ma vin_ac = -20dbv 0 10 20 30 40 50 60 70 80 100 1000 10000 100000 frequency (hz) ripple rejection (db) ta = 25 iout = 10ma figure 86. ripple rejection vs. input voltage figure 87. ripple rejection vs. frequency 0 10 20 30 40 50 60 70 0 50 100 150 200 output current (ma) output noise (uvrms) ta = 25 vin = 4.3v 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output noise density (uv / hz) figure 88. output noise vs. output current figure 89. output noise density vs. frequency
datasheet datasheet 27/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) vout stby=0v1.5v cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=4.3v 20us/div 3.0 vout stby=0v1.5v cout=0.47uf cout=1u f cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 1v/div 1v/div vin=4.3v 20us/div 0.0 2.0 1.0 output volatage(v) 3.0 vout figure 90. startup time ( rout = none ) figure 91. startup time ( rout = 16.5 ohm ) stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2u f 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div vin=4.3v 400ms/div 3.0 stby=1.5v0v vout cout=0.47uf cout=1uf cout=2.2uf 0.0 2.0 1.0 stby voltage(v) 0.0 2.0 1.0 output volatage(v) 1v/div 1v/div 20us/div vin=4.3v 3.0 figure 92. discharge time ( rout = none ) figure 93. discharge time ( rout = 16.5 ohm )
datasheet datasheet 28/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series reference data bu33sa4wgwl (unless otherwise specified, ta=25 ,cin = cout =1 f.) vin=3.8v4.4v vout 3.29 3.31 3.30 output volatage(v) 10mv/div 200mv/div 10us/div 3.8 4.2 4.0 4.4 stby=3.8v4.4v io=10ma cout=1uf input voltage(v) vin=4.4v3.8v vout 10mv/div 200mv/div 10us/div stby=4.4v3.8v io=10ma cout=1uf 3.29 3.31 3.30 output volatage(v) 3.8 4.2 4.0 4.4 input voltage(v) vout output volatage(v) 50mv/div 100ma/div 2.0us/div 0 200 100 output current(ma) 3.25 3.35 3.30 3.20 iout=1ma150ma vin=4.3v stby=4.3v cout=1uf output current(ma) vout 50mv/div 2.0us/div output volatage(v) 3.30 3.40 3.35 3.25 iout=150ma1ma 100ma/div vin=4.3v stby=4.3v cout=1uf 0 200 100 figure 94. load response ( iout = 1ma 150ma) figure 95. load response ( iout = 150ma 1ma) figure 96. line response ( vin= 3.8 v 4.4 v) figure 97. line response ( vin= 4.4 v 3.8 v)
datasheet datasheet 29/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series figure 99. stability area characteristics (example) input/output capacitor it is recommended that an input capacitor is placed near pins between the vcc pin and gnd as well as an output capacitor between the output pin and gnd. the input is valid when the power supply impedance is high or when the pcb trace has significant length. for the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. however, please check the actual functionality of this capacitor by mounting it on a board for the actual application. ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. for additional details, please check with the manufacturer, and select the best ceramic capacitor for your application equivalent series resistance (esr) of a ceramic capacitor capacitors generally have esr (equivalent series resistance) and it operates stably in the esr-i out area shown on the right. since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different esr, please check the esr of the capacitor to be used and use it within the stability area range shown in the right grap h for evaluation of the actual application. 0.01 0.1 1 10 100 0 50 100 150 200 iout[ma] esr[] stable region cin=co=0.47ufta=-40 to 85 unstable region stable region capacity value of ceramic capacitor - dc bias characteristics ( example ) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 00.511.522.533.54 dc bias voltage [v] capacitance change [%] 10-v withstand voltag e b1char acter istics grm 188b11a105ka61d 10-v withstand voltag e b char acter istics 6.3- v withstand voltag e b char acter istics 4-v withstand voltag e x6s characteristics 10-v withstand voltag e f char acter istics 10- v withstand voltag e f char acter istics figure 98. capacity-bias characteristics
datasheet datasheet 30/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series power dissipation (pd) as for power dissipation, an estimate of heat reduction characte ristics and internal power consumption of ic are shown, so please use these for reference. since power dissipation chang es substantially depending on t he implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the power dissipation of ic may lead to deterioration of the original ic performance, such as causing the operation of the thermal shut down circuit or reduction in current capa bility. therefore, be sure to prepare sufficient margin within power dissipation for usage. calculation of the maximum internal power consumption of ic (pmax) p max =(v in -v out )i omax where : v in =input voltage v out = output voltage i omax : maximum output current) measurement conditions evaluation board layout of board for measurement top layer (top view) bottom layer (top view) measurement state with board im plemented (wind speed 0 m/s) board material glass epoxy resin (9 layers) board size 63 mm x 55 mm x 1.6 mm wiring rate top layer metal (gnd) wiring rate: approx. 0% bottom layer metal (gnd) wiring rate: approx. 50% through hole diameter 0.5mm x 6 holes power dissipation 0.41w thermal resistance ja=243.9c/w * please design the margin so that pmax is less than pd (p max < pd) within the usage temperature range figure 100. ucsp50l1(buxxsa4wgwl) power dissipatio n heat reduction characte ristics (reference) 0 0.1 0.2 0.3 0.4 0.5 0255075100125 ta[] pd [w] 0.41w u1 85
datasheet datasheet 31/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series i/o equivalence circuits b1 pin (vout) a1 pin (gnd) a2 pin (stby) b2 pin (vin) figure 101. input / output equivalent circuit vout vin vout vin
datasheet datasheet 32/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series operational notes 1) absolute maximum ratings this product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. in addition, it is impossible to predict a ll destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. 2) gnd potential gnd potential must be the lo west potential of all pins of the ic at all o perating conditions. ensure that no pins are at a voltage below the ground pin at any ti me, even during transient condition. 3) setting of heat carry out the heat design that have adequate marg in considering pd of actual working states. 4) pin short and mistake fitting when mounting the ic on the pcb, pay attention to the orientat ion of the ic. if there is mistake in the placement, the ic may be burned up. 5) actions in strong magnetic field using the ic within a strong magnetic field may cause the ic to malfunction. 6) mutual impedance use short and wide wiring tracks for the power supply and gr ound to keep the mutual impedance as small as possible. use a capacitor to keep ripple to a minimum. 7) stby pin voltage to enable standby mode for all channels, set the stby pin to 0.5 v or less, and for normal operation, to 1.1 v or more. setting stby to a voltage between 0.5 and 1.1 v may cause malfunction and should be avoided. keep transition time between high and low (or vice versa) to a minimum. additionally, if stby is shorted to vin, the ic will swit ch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. if the ic is switc hed on again while this voltage is present, overshoot may occur on the output. theref ore, in applications where these pins are shorted, the out put should always be completely discharged before turning the ic on. 8) over current protection circuit over current and short circuit protection is built-in at the output, and ic destructi on is prevented at the time of load short circuit. these protection circuits are effective in the destructive prevention by su dden accidents, please avoid applications to where the over current protection circuit operates continuously. 9) thermal shutdown this ic has thermal shutdown circuit (tsd circuit). when the temperature of ic chip is higher than 175 , the output is turned off by tsd circuit. tsd circuit is only designed for protecting ic from thermal over load. therefore it is not recommended that you design application where tsd will work in normal condition. 10) actions under strong light a strong light like a halogen lamp may be caused malfunction. in our testing, fluorescenc e light and white led causes little effects for the ic, but infrared li ght causes strong effects on the ic. the ic should be shielded from light like sunrays or halogen lamps. 11) output capacitor to prevent oscillation at output, it is recommended that th e ic be operated at the stable region shown in figure 99. it operates at the capacitance of more than 0.47 f. as capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved.
datasheet datasheet 33/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series ordering information physical dimension tape and reel information marking diagram ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) ucsp50l1 (buxxsa4wgwl) s 0.06 s 0.55max 0.10.05 a b ba 0.05 0.20.05 4- 0.250.05 2 1 0.20.05 b a 0.4 0.4 1pin mark 0.80.05 0.80.05 x x marking lot no. 1pin mark part no. marking bu18sa4wgwl c3 bu25sa4wgwl c9 bu2fsa4wgwl fa bu28sa4wgwl e2 bu30sa4wgwl e5 bu33sa4wgwl e8 e2 rohm part no. output voltage xx=18:1.8v xx= 25:2.5v xx= 2f:2.55v xx= 28:2.8v xx= 30:3.0v xx= 33:3.3v series name sa4w:high-speed sa4w: load response sa4w: low noise sa4w: shutdown sw package gwl: ucsp50l1 gwl: (buxxsa4wgwl) packaging and forming specifications e2:embossed tape and reel ucsp50l1(buxxsa4wgwl) 4wgwl - bux xsa
datasheet datasheet 34/34 tsz02201-0rbr0a300100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.04.04 rev.001 www.rohm.com tsz22111 ? 15? 001 buxxsa4 series revision history date revision changes 04.apr.2013 001 new release
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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